|
Substrate |
Via Hole |
Adhesion
Seed Layer |
Functional
Conductive
Layer |
Barrier
Bonding Layer |
Passivation
Layer |
AI203
17-27W/mk |
50-200mm |
Ti/Cu |
Electroplating
Cu5-100mm
in thickness |
Electroplating
Cu5-100mm
in thickness |
Solder Mask
25-30 mm in
thickness |
|
Tiw/Ti/Cu |
Electroplating
Au0.1-5.0mm
in thickness |
Electroless
Ag0.1-1.0mm
in thickness |
Polyimide
3-8 mm
in thickness |
AIN
170-220W/mk
Up to 4.5 |
Cr/Cu |
Printing
Ag10mm
in thickness |
Electroplating Ni Au3-9mm 0.5-1.5mm
in thickness |
SU-8
2-10mm
in thickness |
|
- |
Printing
CU10mm
in thickness |
Electroplating Ni Ag3-9mm
3.0mm
in thickness |
- |
